AI Infrastructure2026-03-17MIT Technology Review

Future AI Chips Could Be Built on Glass Substrates

The future of AI chip manufacturing may be built on a surprising material: glass. South Korean company Absolics has announced plans to begin commercial production of specialized glass panels designed as substrates for next-generation AI semiconductors. This technology, which leverages material science principles refined over millennia, could replace traditional organic or silicon substrates in data centers. Glass substrates offer potential advantages for the extreme performance and power demands of AI chips. They can provide better thermal management, allow for denser interconnects, and potentially improve signal speed and power efficiency. If successfully adopted, this shift could enable more powerful and efficient AI hardware, addressing some of the critical physical limitations facing chip designers as they push the boundaries of computing.

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